PRINTED CIRCUIT BOARDS - BGA-FBGA / CSP

Type	Specification	Board Picture	Application
BGA/FBGA	Thickness: 0.3+/-0.03mm
	Line W/S: 1.5/1.5mils
	PTH Size: 0.2mm
	Resist Min: 15-35um
	Material: BT
	Surface: Soft AU
CSP	Thickness: 0.19+/-0.04mm
	Line W/S: 1.2/1.2mils
	PTH Size: 0.1mm
	Resist Min: 10-30um
	Material: BT
	Surface: Soft Au

PRINTED CIRCUIT BOARDS | MACHINED PARTS | SHEET METAL FABRICATION | MOLDED PLASTIC

Overview | Multi-Layers / HDI | Micro SD Card / BOC | BGA-FBGA / CSP

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