- Rigid 2-24L Max 4.5T
(FR-4, -5 High Tg, etc)
- Rigid-Flex 3~8L Max
2.4T (P.I, P.E, FR-4)
- Flex & Multiflex Circuits
2~6L Max 1.6T (P.I, P.E.)
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- Automotive
- Telecommunication
- Military
- Aerospace/Satellites
- HDI(Mobile)
- Memory module
- Package substrates
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- Min Line W/S: 2.5/2.5mils
- Impedance Controls to 6%
- Aspect Ratio to 10:1 (Opt)
- Min. BVH 3mils (Mass)
- Min. Thru Via: 6mils (Mass)
- Finish: OSP/Au/Ag/Ti/Carbon
- Lead-time: 7 Ds ETA QT.
1.5~3Wks ETA Mass.
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- ISO9001
- ISO14001
- TS16949
- PCQR2
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- California: 1 Rigid, 1 Flex & Rigid-Flex
- Korea: 4 Rigid,
3 Rigid Flex
- China: 3 Rigid,
1 Flex
- Taiwan: 2 Rigid,
2 Flex
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