| PRINTED CIRCUIT BOARDS - MULTI-LAYERS / HDI
| TYPE |
SPECIFICATION |
BOARD PICTURE |
Multi-layers
(Communication Network LCD TFT Etc)
Layers: 4-24L
|
Material: FR4, Halogen Free |
 |
| Dielectric Thickness: 1.7mils |
| Thru Hole: Min. 150um |
| Inner Line W/S: 3/3mils |
| Out Line W/S 3/3mils |
| Surface: OSP / ENIG, etc. |
| Thick: 0.4~3.2mmT |
HDI
(Cell Phone MCM ETC)
Layers: 4-12L |
Material: FR4, RCC, LDP |
 |
| Dielectric Thickness: 1.7mils |
| BVH: Min. 110-150um |
| IVH: Min. 180um |
| Thru Hole: Min. 150um |
| Inner Line W/S: 3/3mils |
| Out Line W/S: 3/3mils |
| Surface: OSP/ENIG, etc. |
| Thick: 0.4-2.0mmT |
     
PRINTED CIRCUIT BOARDS | MACHINED PARTS | SHEET METAL FABRICATION | MOLDED PLASTIC
Overview | Multi-Layers / HDI | Micro SD Card / BOC | BGA-FBGA / CSP
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